The epoxy single-pack glue УП 5-207М

Is Negotiable

Contact information

Petko Oleg Ivanovich

Director
+380504711138
Email

Payment Types
Prepayment
Transportation Types
Automobile transport

Glue of increased heat resistance and adhesion to a variety of substrates.

Resistant to short-term exposure to temperatures of 250 ° C, combines stiffness, heat resistance with the ability to form vacuum-tight (under special conditions - vacuum-cleaned) adhesive joints in conditions of repeated thermal cycling from minus 60 ° C to 150 - 200 ° C. Excellent adhesion to gold (up to 30 MPa), beryl foil, polyamide, ceramics.

It is used mainly for mounting and sealing microcircuits incl. in multi-layer thin-film microassemblies.